3D Solder Paste Inspection Measurement System

SPI-200-3D

LOW COST 3D SPI System

Low cost, off-line 3D SPI system supports multiple SMT lines for inspecting solder paste printing.

SPI-200-3D will improve your product yield and meet your customer’s requirement with affordable budget.

Same measuring technique as high end automated in-line SPI system.

• 3D SPI off-line, entry level
• Measure solder paste height with laser beam
• 3D real-time view of solder paste
• Zoom 15x – 200x
• Same system can be used for inspecting and measuring BGA solder joints and fine-pitch SMT.

Laser Light Triangulation Method

for solder paste inspection & height measurement

laser triangulation for solder paste height inspection

Easy to use, NO training required, Ready to implement

• Simple mouse clicks to get results FAST
• Economic, off-line, bench-top unit that supports multiple SMT lines
• Save measurements with image, and export measurement results to Excel
• One USB2.0 connection to your Windows computer, install software, and ready to use

3D Solder Paste View, Real Time

3D rotational viewing lens included for

• Solder Inspection
• 3D BGA Inspection
• Soldering Rework

90 degree view into BGA and 360 rotation

Specifications

SPI-200-3D specifications

Related SPI Systems

SPM-300-3D: Manual Solder Paste Inspection System, $10,000 range.

SPI-3000-Auto3D: Automated Solder Paste Inspection System, bench-top off-line, $35,000 range.