3D Solder Paste Inspection Measurement System
$8,000 Price Range | Get Price Quote |
LOW COST 3D SPI System
Low cost, off-line 3D SPI system supports multiple SMT lines for inspecting solder paste printing.
SPI-200-3D will improve your product yield and meet your customer requirement with affordable budget.
Same measuring technique as high end automated in-line SPI system.
- 3D SPI off-line, entry level
- Powerful 3D real-time view of solder paste
- Zoom 30x – 200x
- Inspection and measurement of solder joints, components, traces, pads, holes, and BGA
- Versatile, 3-in-1 system, economical
Laser Light Triangulation Method
for solder paste inspection & height measurement

laser triangulation for solder paste height inspection
Easy to use, NO training required, Ready to implement
- Simple mouse clicks to get results FAST
- Economic, off-line, bench-top unit that supports multiple SMT lines
- Save measurements with image, and export measurement results to Excel
- One USB2.0 connection to your Windows computer, install software, and ready to use
3D Solder Paste View, Real Time
3D rotational viewing lens included for
- Solder Inspection
- 3D BGA Inspection
- Soldering Rework

90 degree view into BGA and 360 rotation
- solder ball
- see solder surface and texture
- cracked BGA solder joints
- PCB inspection
- BGA package
- lifted fine pitch
- J lead inspection
Specifications
Related SPI Systems
SPM-300-3D: Manual Solder Paste Inspection System, $10,000 range.
SPI-3000-Auto3D: Automated Solder Paste Inspection System, bench-top off-line, $35,000 range.
$8,000 Price Range | Get Price Quote |