Solder Paste Inspection Systems


3D Solder Paste Inspection Systems

Solder paste inspection systems help you to ensure the solder paste printing process is within stencil printing specifications to eliminate unnecessary defects and reworks that cost more man hours and disrupt the manufacturing process. We offer manual off-line and automated off-line systems for different budgets.

SPI-200-3D and SPM-300-3D both offer:

  • solder paste inspection measurement capability PLUS
  • real-time 3D inspection for solder paste, solder joints, and SMT inspection
  • image documentation

SPI-3000-3D offers:

  • Programmable automated solder paste inspection
  • Off-line table-top model to support multiple SMT lines
  • SPC included

 

SPI-200-3D 3D solder paste inspection measurement system

3D solder paste inspection measurement system (SPI-200-3D)

Most economic 3D SPI system SPI-200-3D:

  • Laser Light Triangulation method for solder paste height inspection
  • Also XY measurement for measuring pad, trace, pitch, hole, & connector. Capable of all SMT measurement needs.
  • 30x-200x Zoom
  • Manual 3D rotational lens included
  • 3D real-time inspection of solder paste, solder joints, and SMT components
  • Take pictures of defects, annotation, save for documents, email for communication
  • Price range under $8,000

3D solder paste inspection measuring system, manual (SPM-300-3D)

Manual 3D solder paste inspection system

  • Laser Light Triangulation method for solder paste height inspection
  • Also XY measurement for measuring pad, trace, pitch, hole, & connector. Capable of all SMT measurement needs.
  • 50x-300x Zoom lens
  • Motorized 3D rotation lens included
  • 3D inspection of solder paste, solder joints, SMT components, wire bonding
  • Take pictures of defects, annotation, save for documents, email for communication
  • Price range under $10,000

Automatic 3D solder paste inspection system (SPI-3000)

Automatic 3D solder paste inspection system

  • Fully programmable, fully automatic, off-line bench-top system supports multiple SMT lines
  • Laser Light Triangulation method for scanning solder paste heights
  • One touch operation: load circuit board, press start, run program for complete board, results generated in minutes
  • Repetitive and accurate measurement without human error
  • SPC software included
  • 3D image rendering of solder paste for viewing verification
  • Price range under $35,000

 

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