Automatic 3D Solder Paste Inspection System Bench-Top Model


Automatic 3D solder paste inspection system (SPI-3000)

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Fully automated 3D solder paste inspection, bench-top, low cost system for SMT process. Fully programmable and automatic. The whole board inspection takes only minutes and results are presented with SPC. One bench top unit is capable of supporting multiple SMT lines.

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  • Fully Automated 3D solder paste inspection
  • 3D scan measure height, area and volume
  • 3D simulation & recombination view
  • Programmable multi-area 3D scan measurement
  • Auto focus check to offset PCB warping
  • Programmable, automatic & repeatable
  • Large board size with adjustable board holder
  • Full SPC functions
  • Product and production line details entry
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3D viewing of scanned solder paste is created for better visualization of screen printing in a three dimensional viewing model. Click and drag to view from any angles, any orientation. Color contrast highlights 3D morphology of solder paste printing.

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 Actual demonstration of 3D solder paste inspection

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[/wptab] [wptab name=’Related SPI Systems’]

SPI-200-3D: Manual Solder Paste Inspection System, $8,000 range.

SPM-300-3D: Manual Solder Paste Inspection System, $10,000 range.

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$35,000 price range

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